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Effect of Organic Amine in Colloidal Silica Slurry on Polishing Rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization
- 제목
- Effect of Organic Amine in Colloidal Silica Slurry on Polishing Rate Selectivity of Copper to Tantalum-nitride Film in Copper Chemical Mechanical Planarization
- 저자
- 백운규
- 발행일
- 2008-05-20
- 학회명
- 213th ECS Meeting
- 개최지
- Phoenix Covention Center(USA)