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초록
We developed a new Cu-Zn wetting layer for Pb-free solders. By adding Zn to the Cu wetting layer, intermetallic growth in the Sn-Ag-Cu (SAC) solder interfaces was delayed. Cu3Sn intermetallic compounds and microvoids were not observed ill the SAC/Cu-Zn interfaces after aging. The drop reliability of the SAC solder/Cu-Zn joints was excellent.
키워드
SN-AG-CU; INTERFACIAL REACTIONS; SN-3.5AG SOLDER; ZN; MICROSTRUCTURE; RELIABILITY; ALLOYS; GROWTH
- 제목
- A new solder wetting layer for Pb-free solders
- 저자
- Oh, Chang Yul; Roh, Hee-Ra; Kim, Young Min; Lee, Jin Soo; Cho, Hae Young; Kim, Young-Ho
- 발행일
- 2009-02
- 유형
- Article
- 권
- 24
- 호
- 2
- 페이지
- 297 ~ 300