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A new fan-out package structure utilizing the selfalignment effect of molten solder to improve the die shift and enhance the thermal properties

  • 김영호
제목
A new fan-out package structure utilizing the selfalignment effect of molten solder to improve the die shift and enhance the thermal properties
저자
김영호
발행일
2017-06-01
학회명
2017 IEEE 67th Electronic Components and Technology Conference
개최지
Lake Buena Vista, Florida, USA

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