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- 제목
- Die Warpage Control Applying UBM (Under Bump Metallurgy) on Die Back-Side for FanOut Package Process Applications
- 저자
- 김영호
- 발행일
- 2018-05-30
- 학회명
- The 2018 IEEE 68th Electronic Components, and Technology Conference
- 개최지
- Sheraton San Diego Hotel & Marina San Diego, California, USA