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- 제목
- Electromagnetic interference shielding effect of double layer copper patterns with moisture ventilation at package level
- 저자
- 김영호
- 발행일
- 2019-11-15
- 학회명
- The 18th International symposium on Microelectronics and Packaging jointed with the 21st International Conference on Electronic Materials and Packaging
- 개최지
- Hotel Aqua Palace, Busan, Korea