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A New Ni-Zn Under Bump Metallurgy for Pb-Free Solder Bump Flip Chip Application

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A New Ni-Zn Under Bump Metallurgy for Pb-Free Solder Bump Flip Chip Application
저자
김영호
발행일
2010-06-02
학회명
60th Electronic Components and Technology Conference
개최지
Las Vegas, Nevada USA

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