The Effects of Water-Soluble Oragnic Additives on the Rhelogical Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process

  • 박재근
제목
The Effects of Water-Soluble Oragnic Additives on the Rhelogical Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process
저자
박재근
발행일
2004-06-04
학회명
International Conference on Crystal Growth And LED Epi and Substrate
개최지
Sungkyunkwan University, Suwon, Korea