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The Reliability of COG Joints Fabricated Using Sn/Cu Bumps and NCAs

  • 김영호
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The Reliability of COG Joints Fabricated Using Sn/Cu Bumps and NCAs
저자
김영호
발행일
2010-05-13
학회명
International Conference on Electronics Packaging (ICEP 2010 )
개최지
Sapporo Convention Center, Hokkaido, Japan

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