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Measurement of the Interfacial Strength of Thin Metal Film by Laser Spallation Method for Advanced Wafer Level Package
- 제목
- Measurement of the Interfacial Strength of Thin Metal Film by Laser Spallation Method for Advanced Wafer Level Package
- 저자
- 이승환
- 발행일
- 2024-05-31
- 학회명
- The 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
- 개최지
- Gaylord Rockies Resort & Convention Center Denver