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Effect of organic particles as abrasives on the surface roughness of silicon wafer surface in final polishing of silicon wafer
- 제목
- Effect of organic particles as abrasives on the surface roughness of silicon wafer surface in final polishing of silicon wafer
- 저자
- 백운규
- 발행일
- 2005-06-14
- 학회명
- International Conference on Electroceramics 2005
- 개최지
- kist