다중 IGBT 모듈 부착 히트싱크 유로 형상에 따른 냉각 성능 분석

초록

In this study, the thermal dissipation performance and pressure drop of a heat sink with multiple insulated gate bipolar transistors (IGBTs) were analyzed. Four types of flow channel designs, viz., parallel, serpentine, parallel vertical serpentine, and parallel horizontal serpentine, were designed and compared using computational fluid dynamics (CFD) simulations. Temperature analysis revealed that the parallel flow heat sink exhibited significant temperature non-uniformity due to asymmetric coolant flow distribution and that the serpentine flow heat sink maintained a uniform temperature distribution but exhibited a high-pressure drop of 95.5 kPa. The parallel vertical serpentine heat sink showed an uneven cooling effect with a central module temperature ~10°C higher than other modules. In contrast, the parallel horizontal serpentine heat sink minimized temperature differences to within 2°C while achieving a low-pressure drop of 15.2 kPa, and when heat dissipation was evaluated at a reference temperature of 80°C, this heat sink demonstrated superior cooling performance. Based on these results, the parallel horizontal serpentine heat sink is proposed as the optimal cooling solution because it provides efficient heat dissipation and is subject to smaller parasitic losses due to a lower pressure drop.

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