고온-광 복합 시험이 LED 패키지용 실리콘 충진재에 미치는 영향

초록

In this paper, a combined stresses environment similar to the actual use environment of silicone encapsulant used in light emitting diode(LED) packages is designed as a combined high-temperature and light test(HTLT). High-temperature tests are conducted on silicone encapsulant samples at 85°C and 120°C to demonstrate the effectiveness of the combined HTLT on silicone encapsulant used in LED packages. In addition, a combined HTLT for a silicone encapsulant is performed using a test jig proposed to induce the light output of the LED package to the silicone encapsulant sample at 85°C and 120°C, the same as the high-temperature test. After the test, the transmittance of the silicone encapsulant is measured, and the Raman analysis of the silicone encapsulant is used to infer the cause of the difference in the transmittance shown in the high-temperature test and the combined HTLT.

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