ScholarWorks@한양대학교

상세 보기

A new COF Bonding Technique using Sn bumps and a Non-conductive Adhesive (NCA) for image sensor packaging

  • 김영호
제목
A new COF Bonding Technique using Sn bumps and a Non-conductive Adhesive (NCA) for image sensor packaging
저자
김영호
발행일
2009-05-29
학회명
the 59th Electronic Components and Technology conference
개최지
San Diego, USA

ScholarWorks@한양대학교

(04763) 서울특별시 성동구 왕십리로 222 Tel. +82-2-2220-1370 +82-2-2220-1366

COPYRIGHT © 한양대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.