Vibration analysis of FBGA solder joints of the memory module subjected to harmonic excitation

초록

Vibration analysis of Fine-pitch Ball Grid Array (FBGA) packages mounted on a Printed Circuit Board (PCB) subjected to harmonic excitation is performed by using finite element method (FEM). A finite element model of a memory module is composed of three main parts, packages, simplified solder balls and bare PCB. At first, natural frequencies and mode shapes of the developed model were confirmed experimentally. Secondly, the harmonic excitation experiment for the module was carried out at the first natural frequency of the memory module, and it was verified with the simulation by using mode superposition method at a constant acceleration.