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The effect of solder wetting on nonconductive adhesive trapping in NCA applied flip-chip bonding

  • 김영호
제목
The effect of solder wetting on nonconductive adhesive trapping in NCA applied flip-chip bonding
저자
김영호
발행일
2015-10-15
학회명
The 14th International Symposium on Microelectronics and Packaging
개최지
KINTEX, Seoul / Ilsan, Korea

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