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A Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect

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제목
A Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
저자
전형탁
발행일
2003-11-05
학회명
AVS 50th International Symposium & Exhibition
개최지
Baltimore, Maryland U.S.A

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