폐 CPU 칩의 해체장치 제작 및 성능 평가

초록

In this study, Au distribution in F-PGA chip and W-BGA chip were examined to recover Au effectively from CPU chips. The result showed that 80.8% and 89.8% of Au exist in terminal of F-PGA chip and bare die of W-BGA chip, respectively. Based on the fact that Au exists in specific parts of the chips, an CPU chip dismantling apparatus was developed. The experimental variables were roller rotating speed, heat temperature of IR heater and heating time. Terminals of F-PGA chips were completely recovered under the temperature of 300o C and the residence time of 90 s. Bare dies of W-BGA chips were completely recovered as well under the temperature of 300o C, the roller rotating rate of 90 rpm and the residence time of 90 s.

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