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Characteristics of Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect

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Characteristics of Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
저자
전형탁
발행일
2002-08-20
학회명
AVS Topical Conference on Atomic Layer Deposition
개최지
Hanyang University

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