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A Chip on Flex (COF) Bonding Technique Using Square and Hemispherical Sn bumps

  • 김영호
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A Chip on Flex (COF) Bonding Technique Using Square and Hemispherical Sn bumps
저자
김영호
발행일
2009-04-15
학회명
ICEP 2009(International Conference on Electronics Packaging)
개최지
Kyoto, Japan

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