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Reliability Evaluations of pb-free Solder joint Formed Using Sn-Ag-Cu solder ball and Sn-Bi-Ag solder paste
- 제목
- Reliability Evaluations of pb-free Solder joint Formed Using Sn-Ag-Cu solder ball and Sn-Bi-Ag solder paste
- 저자
- 임원빈
- 발행일
- 2025-12-04
- 학회명
- EPTC 2025
- 개최지
- Singapore