상세 보기
Impact of TSV Configuration on Thermal Performance of High Bandwidth Memory
- 제목
- Impact of TSV Configuration on Thermal Performance of High Bandwidth Memory
- 저자
- 임재명
- 발행일
- 2024-11-07
- 학회명
- International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics