ScholarWorks@한양대학교

상세 보기

A SAM-Based Approach for Damage-Free Release of Ultrathin Silicon Devices from SOI Wafers

제목
A SAM-Based Approach for Damage-Free Release of Ultrathin Silicon Devices from SOI Wafers
저자
정예환
발행일
2025-11-11
학회명
KISM 2025 BUSAN
개최지
부산, 대한민국

ScholarWorks@한양대학교

(04763) 서울특별시 성동구 왕십리로 222 Tel. +82-2-2220-1370 +82-2-2220-1366

COPYRIGHT © 한양대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.