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Effect of Ni-P Plating Temperature on Interfacial Reaction between Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder

  • 김영호
제목
Effect of Ni-P Plating Temperature on Interfacial Reaction between Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder
저자
김영호
발행일
2017-10-18
학회명
16th International Symposium on Microelectronics and Packaging 2017
개최지
COEX, Seoul, Korea

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