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초록
The reflowed Sn bumps and through via hole electrodes were successfully joined through the plastic deformation of Sn bumps. The contact resistance of solder joints was very low. The contact resistance was not sensitive to the bonding pressure, bonding temperature, and bonding time. The electrical resistance was slightly increased after multiple reflows.
키워드
ABS resins; Brazing; Contact resistance; Electric properties; Flip chip devices; Mechanical properties; Welding; International conferences; Sn bumping; Solder joints; Tin
- 제목
- The effect of bonding conditions on the electrical properties of solder joints fabricated by mechanical caulking using reflowed Sn bumps
- 저자
- Yang, Ju Heon; Kim, Young Ho; Moon, Jae Seung; Lee, Won Jong
- 발행일
- 2007-11
- 유형
- Conference Paper
- 저널명
- EMAP 2007 - International Conference on Electronic Materials and Packaging 2007
- 페이지
- 1 ~ 3