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Effect of characteristics of nano-colloidal silica abrasives on wafer surface roughness for wafer touch polishing
- Park, Jin-Hyung;
- Paik, Ungyu;
- Park, Jea-Gun
Citations
SCOPUS
0초록
The purpose of this study is to reveal the mechanism of wafer touch polishing by high purity colloidal silica slurry containing organic surfactants such as HEC (hydroxyl-ethyl cellulose). The effect of surfactant concentration on wafer touch polishing was studied with the aim of improving roughness on wafer surface after polishing. As a result, the level of haze and micro-roughness are decreased with the decrease of surfactant concentration.
키워드
Haze; Non-ionic surfactant; Roughness; Slurry; Wafer polishing; Abrasives; Concentration (process); Polishing; Silicon wafers; Slurries; Surface active agents; Surface roughness; Haze; Non-ionic surfactant; Wafer polishing; Silica
- 제목
- Effect of characteristics of nano-colloidal silica abrasives on wafer surface roughness for wafer touch polishing
- 저자
- Park, Jin-Hyung; Paik, Ungyu; Park, Jea-Gun
- 발행일
- 2007-06
- 유형
- Conference Paper
- 권
- 121-123
- 호
- PART 2
- 페이지
- 1229 ~ 1232