ScholarWorks@한양대학교

상세 보기

Adhesion improvement of polyimide/Epoxy interface using various curing agents

  • 김성훈
제목
Adhesion improvement of polyimide/Epoxy interface using various curing agents
저자
김성훈
발행일
2000-03-23
학회명
American Chemical Society, Polymeric Materials Science and Engineeing
개최지
Anaheim

ScholarWorks@한양대학교

(04763) 서울특별시 성동구 왕십리로 222 Tel. +82-2-2220-1370 +82-2-2220-1366

COPYRIGHT © 한양대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.