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Thermo-compression flip-chip bonding technology using nonconductive adhesives for ultra-fine pitch applications

  • 김영호
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Thermo-compression flip-chip bonding technology using nonconductive adhesives for ultra-fine pitch applications
저자
김영호
발행일
2017-06-22
학회명
9th Korea-Japan Berkeley Symposium on Advanced Materials
개최지
University of California, Berkeley

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