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- 제목
- The Reliability of Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 um Pitch Cu Pillar Bumps and Low-Temperature Curable NonConductive Adhesive (NCA) and Effect of NCA Trapping
- 저자
- 김영호
- 발행일
- 2018-05-30
- 학회명
- The 2018 IEEE 68th Electronic Components, and Technology Conference
- 개최지
- Sheraton San Diego Hotel & Marina, San Diego, California, USA