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초록
A new chip-to-chip interconnection method utilizing mechanical caulking has been developed recently. In this method, bonding between the chips is achieved by deformation-injection of Au stud bump on a chip into the through via hole in the other chip. In this paper, we introduce a modified caulking technology using reflowed Sn bumps instead Au stud bumps since Sn can be deformed more easily than Au. The chip-to-chip interconnection using reflowed Sn bumps and through via hole electrodes was successfully made at room temperature or at 270°C. The contact resistance of the solder joint was less than 35 mΩ per joint.
키워드
Chip scale packages; Electronics packaging; Flip chip devices; Gold; Studs (structural members); Technology; Tin; Tin alloys; Contact-resistance; Electronic Packaging; Interconnection methods; International conferences; Room temperatures; Sn bumping; Solder joints; Stud bumping; Via holes; Electronic equipment manufacture
- 제목
- Chip-to-chip interconnection by mechanical caulking using reflowed Sn bumps
- 저자
- Yang, Ju Heon; Kim, Young Ho; Moon, Jae Seung; Lee, Won Jong
- 발행일
- 2007-08
- 유형
- Conference Paper
- 저널명
- Proceedings of the Electronic Packaging Technology Conference, EPTC