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Kinetics of Intermetallic Compound Formation at the Interface between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrate

  • 김영호
제목
Kinetics of Intermetallic Compound Formation at the Interface between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrate
저자
김영호
발행일
2010-02-17
학회명
TMS 2010
개최지
Seattle, Washington USA

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