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An Advanced Fan-out Package Utilizing Backside Metallization and Solder Self-alignment

  • 김영호
제목
An Advanced Fan-out Package Utilizing Backside Metallization and Solder Self-alignment
저자
김영호
발행일
2018-06-21
학회명
10 th Korea-Japan Berkeley Symposium on Advanced Materials
개최지
Rm 107, Graduate Institute of Ferrous Technology, POSTECH

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