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Development of 20 µm Pitch COG Joints Fabricated Using Sn/Cu Bumps and NCAs

  • 김영호
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Development of 20 µm Pitch COG Joints Fabricated Using Sn/Cu Bumps and NCAs
저자
김영호
발행일
2011-10-18
학회명
Materials Science and Technology (MS&T) 2011
개최지
Columbus, Ohio, USA

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