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Laser spallation test for quantifying the interfacial adhesion between copper and silicon nitride thin films deposited by low-pressure chemical vapor deposition and plasma-enhanced chemical vapor deposition process
- 제목
- Laser spallation test for quantifying the interfacial adhesion between copper and silicon nitride thin films deposited by low-pressure chemical vapor deposition and plasma-enhanced chemical vapor deposition process
- 저자
- 이승환
- 발행일
- 2025-04-25
- 학회명
- ICMDT2025
- 개최지
- Arcrea HIMEJI