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Selectivity Enhancement on the Removal of SiO2 to SiN4 films with Addition of triethanolamine(TEA) in ceria slurry during Shallow Trench Isolation Chemical Mechanical Polishing(STI CMP)

  • 박재근
제목
Selectivity Enhancement on the Removal of SiO2 to SiN4 films with Addition of triethanolamine(TEA) in ceria slurry during Shallow Trench Isolation Chemical Mechanical Polishing(STI CMP)
저자
박재근
발행일
2007-12-12
학회명
The 5th International Conference on Advanced Material and Device
개최지
Ramada Plaza Jeju Hotel

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