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Effect of Pad Finish on the Reliability of Cu Bumps Fabricated Using Cu3Sn and ENIG Capping Layers for TSV Applications

  • 김영호
제목
Effect of Pad Finish on the Reliability of Cu Bumps Fabricated Using Cu3Sn and ENIG Capping Layers for TSV Applications
저자
김영호
발행일
2011-10-17
학회명
Materials Science and Technology (MS&T) 2011
개최지
Columbus, Ohio, USA

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