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초록
We investigate the formation of Cu nanoparticles in a polyimide (PI) film. The Cu nanoparticles were uniformly dispersed in the PI film by curing a precursor of PI, polyamic acid (PAA) containing Cu ions. The PAA was imidized to PI at 350°C for 2 hours in forming gas (5% H 2+95% N 2), accompanying the nanoparticle precipitation. X-ray diffracton patterns revealed that Cu nanoparticles formed by curing in a reducing atmosphere, and transmission electron microscopy showed that about 5 nm sized Cu nanoparticles were dispersed in the PI film.
키워드
Copper nanoparticles; Cu ions; Cu nanoparticles; Forming gas; Nanoparticle precipitation; PI film; Polyamic acids; Polyimide film; Reducing atmosphere; Curing; Nanoparticles; Nanotechnology; Polyimides; Polymeric films; Transmission electron microscopy; Copper
- 제목
- Fabrication of copper nanoparticles in 6FDA-ODA polyimide film
- 저자
- Choi, Dong Joo; Ahnn, Key-one; Choi, Min Young; Kim, Young Ho
- 발행일
- 2012-02
- 유형
- Conference Paper
- 저널명
- 2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011
- 페이지
- 517 ~ 517