상세 보기
- 제목
- Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application
- 저자
- 김영호
- 발행일
- 2013-05-30
- 학회명
- Electronic Components & Technology Conference (ECTC) 2013
- 개최지
- The Cosmopolitan of Las Vegas, Nevada, USA