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Development of Chip-on-flex Bonding using Sn-based Bumps and Non-conductive Adhesive

  • 김영호
제목
Development of Chip-on-flex Bonding using Sn-based Bumps and Non-conductive Adhesive
저자
김영호
발행일
2014-11-18
학회명
International Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014)
개최지
Jeju Island, Korea

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