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Highly Reliable and Low Temperature Chip-on-Flex (COF) Bonding in 20 μm Pitch Application

  • 김영호
제목
Highly Reliable and Low Temperature Chip-on-Flex (COF) Bonding in 20 μm Pitch Application
저자
김영호
발행일
2013-10-08
학회명
EMAP 2013 (15th International Conference On Electronic Materials and Packaging)
개최지
일산 KINTEX

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