Investigation on the Low Temperature Fine Pitch COP(Chip on Plastic) Technique with NCA Applied

초록

variety of flexible materials can serve as the substrate, such as, polyimide(PI), polyether sulfone(PES), polyethylene terephthalate(PET) films, as well as epoxy, among which the PES is considered to be used in a first approach because of its higher thermal stability and acceptable cost compared to other flexible substrates.