ScholarWorks@한양대학교

상세 보기

Vibration analysis of FBGA solder joints of the memory module subjected to harmonic excitation

  • 장건희
제목
Vibration analysis of FBGA solder joints of the memory module subjected to harmonic excitation
저자
장건희
발행일
2010-05-13
학회명
2010년 춘계학술대회논문집
개최지
제주

ScholarWorks@한양대학교

(04763) 서울특별시 성동구 왕십리로 222 Tel. +82-2-2220-1370 +82-2-2220-1366

COPYRIGHT © 한양대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.