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COF bonding Technology Ushing Tin Bumps and Non-conductive Adhesives (NCAs) for CMOS Images Sensor Device

  • 김영호
제목
COF bonding Technology Ushing Tin Bumps and Non-conductive Adhesives (NCAs) for CMOS Images Sensor Device
저자
김영호
발행일
2008-06-12
학회명
International Conference on Electronics Packaging
개최지
Tokyo, Japan

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