Formation of Cu or Cu2O nanoparticles embedded in a polyimide film for nanofloating gate memory

  • Choi, Dong Joo
  • Kim, Young-Ho
Citations

SCOPUS

2

초록

A Cu nanoparticles/polyimide (PI) or Cu2O nanoparticles/PI hybrid materials were fabricated by curing at 350°C for 2 hours in H 2 or N2 atmosphere respectively, which resulted from the decomposition of the complex formed between a Cu film and the PI precursor, polyamic acid (PAA). Two kinds of PI films, thermosetting PI and thermoplastic PI were used. The A1 was deposited on the top PI as the top electrode and In as the bottom electrode was soldered on the back side of the samples. The memory effect of A1/PI/Cu (or Cu2O) nanoparticles/PI/p-type Si (100) structure will be also discussed with the results of the capacitance-voltage (C-V) measured at room temperature.

키워드

Bottom electrodesCapacitance voltageCu filmsMemory effectsNanofloating gate memoryPI filmPolyamic acidsPolyimide filmRoom temperatureSi(1 0 0)Hybrid materialsNanoelectronicsPolyimidesPolymeric filmsThermosetsCopper
제목
Formation of Cu or Cu2O nanoparticles embedded in a polyimide film for nanofloating gate memory
저자
Choi, Dong JooKim, Young-Ho
DOI
10.1109/INEC.2010.5424661
발행일
2010-03
유형
Conference Paper
저널명
INEC 2010 - 2010 3rd International Nanoelectronics Conference, Proceedings
페이지
244 ~ 245