Via interface modification of embedded chip resistor packages and its effect on drop shock reliability

  • 김영호
제목
Via interface modification of embedded chip resistor packages and its effect on drop shock reliability
저자
김영호
발행일
2014-11-17
학회명
International Conference Electronic Materials and Nanotechnology for Green Environment 2014(ENGE 2014)
개최지
Jeju Island, Korea