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Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders

  • 김영호
제목
Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders
저자
김영호
발행일
2012-04-18
학회명
12th Inyernational Conference on Electronics Packaging (ICEP)
개최지
Tokyo Big Sight, Tokyo, Japan

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