ScholarWorks@한양대학교

상세 보기

The Effect of Pd Thickness in the Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Their Mechanical Properties

  • 김영호
제목
The Effect of Pd Thickness in the Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Their Mechanical Properties
저자
김영호
발행일
2011-03-03
학회명
TMS 2011
개최지
San Diego, CA, USA

ScholarWorks@한양대학교

(04763) 서울특별시 성동구 왕십리로 222 Tel. +82-2-2220-1370 +82-2-2220-1366

COPYRIGHT © 한양대학교 All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.