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- 제목
- The effect of solder deformation on wetting characteristic on interfacial microstructure of Sn-3.5Ag solder on Cu or Cu substrate
- 저자
- 김영호
- 발행일
- 2012-09-17
- 학회명
- international conference on Electronic Materials and Nanotechnology for Green Environment
- 개최지
- Ramada plaza Jeju hotel, Jeju island, Korea