Reaction between Sn-In solder and bump metallurgy

  • 김영호

초록

LCD has been widely used as plat panel disply for cellular phones, PDA systems, and notebook coumputers because of its low power consumption,slim size, and lightness.

제목
Reaction between Sn-In solder and bump metallurgy
저자
김영호
발행일
2003-11-05
학회명
The 3rd international symposium on designing, processing and properties of advanced engineeri