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The Rheological behavior of colloidal sillica slurry and its influence on wafer polishing process
- 제목
- The Rheological behavior of colloidal sillica slurry and its influence on wafer polishing process
- 저자
- 백운규
- 발행일
- 2004-04-19
- 학회명
- The 106th Annual Meeting & Exposition of The American Ceramic Society
- 개최지
- Indianapolis