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Effect of Eco-friendly Cu-Zn Wetting Layers on Board Level Drop Impact Reliability of Sn-Ag-Cu Solder Joint

  • 김영호
제목
Effect of Eco-friendly Cu-Zn Wetting Layers on Board Level Drop Impact Reliability of Sn-Ag-Cu Solder Joint
저자
김영호
발행일
2013-10-07
학회명
EMAP 2013 (15th International Conference On Electronic Materials and Packaging)
개최지
일산 KINTEX

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